VIA Gallery

China High-Tech Fair ELEXCON 2010
VIA attended China High-Tech Fair ELEXCON during 16-21 November 2010 in Shenzhen. VIA embedded boards, notebooks and S3 graphics cards were shown at CHTF. VIA EPIA-P820 embedded board and Nano+VX900 won “Innovation Awards & quot”
Photos 1-23 (23 Total)
VIA_Booth_at_CHTF_2010_1.jpg VIA_Booth_at_CHTF_2010_2.jpg VIA_Embedded_Mainboard1.jpg VIA_Embedded_Mainboard2.jpg VIA_Award_winning_Products.jpg EPIA-P820.jpg Certificate_of_Reward_for_EPIA_P820.jpg VIA_Nano_VX900.jpg Certificate_of_Reward_for_VIA_Nano_VX900.jpg
Chen_Yunlin_Visited_VIABooth.jpg Foreign_Visitors_to_VIA_Booth.jpg Foreign_Visitors_to_VIA_Booth1.jpg A_View_from_VIA_Booth.jpg A_view_from_VIA_booth1.jpg VIA_Telecom_Booth1.jpg Robot.jpg S3_Graphics.jpg Jinghan_Netbook.jpg
WonderMedia_Netbook.jpg WonderMedia_Flytouch.jpg Taiji_UMPC.jpg Taiji_UMPC1.jpg OLPC1.jpg